With the 21st century upon us, research and development in multimedia technology is growing in importance. In recent years, as the miniaturization and performance of electronic devices accelerate, IC packaging technology is changing from surface mount technology, akin to QPF, to area array surface mount technology, represented by BGA and CSP. To support such an accelerated advancement of electronic devices, radical improvements in surface as well as VLSI/ULSI treatment technology are mandatory. Tomorrow's high-tech industries will demand even more precision and further miniaturization of devices as the need increases for smaller, lighter, and more powerful electronic products, such as cellular phones, video cameras, personal computers, DVDs, etc. This is why such an aggressive migration of circuit board surface mount technology, from QPF and SOP to BGA and CSP, further miniaturization, and higher density VLSI/ULSI are taking place. Electro Fine Forming is Maxell's response to the demands of these rapidly evolving industries.

• STAY LAND technology. This provides precision control over the thickness of the plating, ensuring a uniform metal deposition density.
• Parex technology. This makes possible high-resolution masking for precise forming, contributing to superior electroplating technology.

• a superior cross-section profile
• the ability to form holes with diameters less than the plating
• ultra-precise hole diameters (with tolerances less than ±5% of the plate thickness or 3μm)
• increased hardness (Hv 450-500)
• complete control on plating thickness

Electro Fine Forming will play an important role in many fields besides high-precision electronic device fabrication.