The basic idea of Electro Fine Forming technology is similar to that of conventional electroplating. A nickel plating solution is kept at the optimal temperature by a heating element. The anode is attached to the metal pellet for plating, while the cathode is attached to the target material. When electricity is applied, the metal pellets on the anode begin ionizing into the solution and start to deposit onto the target material. (Figure 1) Usually the plating on these items is thicker than most plating since they are used as metal molds and/or some vital parts. Figure 2 illustrates the processes of Electro Fine Forming. As opposed to the conventional etching procedures where forming of a hole is accomplished by corroding a part of the plating, in Electro Fine Forming the holes are formed in advance utilizing precision patterning. Then the terminals are formed by advanced precision electroplating around the holes afterward. This method has more advantages than simply the precise forming of terminals..

• Electroplate metal deposition is proportional to the electrical current, resulting in a uniform deposition of metal per unit area.
• Because of this, a larger surface will have thinner plating than a smaller surface area.
• By providing "Stay" "Land," pattern-less area, to be plated for compensating this effect.